ID 原文 译文
44196 通过复现试验,确认了导致稳压器失效的原因是输入端的高能量外部过电应力致使过热保护管开启, Based on the reappearance test, the failure reason of the voltageregulator is an external high power electrical overstress applied to the input port.
44197 并在过流与过热的条件下产生与电流方向一致的电迁移痕迹, The electrical overstress made the overheat protection transistor open, forming an electromigration mark consistent with the currentdirection under overheat and overcurrent.
44198 从而使过热保护管的集电极和发射极短路,引发稳压器失效。 The electromigration mark caused short circuit between the collector and the emitter of the overheat protection transistor, making the voltage regulator fail.
44199 设计了一种提高固定开关频率 DC-DC 转换器负载瞬态速度的电路。 A circuit for increasing the load transient speed of a fixed switching frequency DC-DCconverter was presented.
44200 该电路通过在负载跳变过程中改变开关频率的方式来提高负载瞬态响应速度。 The transient response speed of the load was improved by changing the switching frequency during the load jump.
44201 在负载电流瞬态变化时,DC-DC输出电压的跳变量通过反馈电压采样和放大后来控制开关频率。 When the load transient current changes, the DC-DC output voltage jumpis sampled and amplified by feedback voltage to control the switching frequency.
44202 负载电流从小到大跳变时开关频率增加,在负载电流从大到小跳变时开关频率降低。 The switching frequencyincreases with the load transient change from light to heavy and decreases with the load transient changefrom heavy to light.
44203 整个芯片后仿真结果表明,所设计的电路可以改善负载瞬态响应,在输入电压 12 V、输出电压 5 V 条件下,负载电流由 1 A 3 A 跳变时,输出电压过冲量降低了 26 mV,负载电流由 3 A 跳变到 1 A 时,输出电压过冲量降低了 52 mV。该电路在一款 0. 18 μm 高压 BCD 工艺的降压型 DC-DC 转换器芯片中进行了投片验证。 The whole chip post simulation results indicate that the proposed novel circuit can improve the load transient response.Under the condition of 12 V input and 5 V output, the undershoot of output voltage decreases by 26 mV when the load transient current rising from 1 A to 3 A, and the undershoot of output voltage decreases by 52 mV when the load transient current falling from 3 A to 1 A. ADC-DC buck converter with the proposed structure was fabricated with a 0.18 μm BCD process for validation.
44204 研究了阻挡层化学机械抛光 ( CMP) 过程中脂肪醇聚氧乙烯醚 ( JFC) 和过滤器对划伤缺陷的影响。 The effects of primary alcobol ethoxylate (JFC) and filter on scratch defects in the chemical mechanical polishing (CMP) process were studied.
44205 分别采用含不同体积分数 JFC 的抛光液和三种抛光液循环系统对 300 mm 铜布线图形片进行阻挡层抛光。 The 300 mm copper pattern wafer waspolished by the polishing slurry with JFC of different volume fractions and three kinds of slurry circulationsystems, respectively.