| ID | 原文 | 译文 |
| 2693 | 本文提出一种基于量测转换交互多模型(Interactive Multiple Model，IMM)的目标跟踪算法，其以 IMM为框架，并结合静态融合滤波器处理多普勒量测的结构，解决多普勒雷达机动目标跟踪问题。 | A measurement conversion based interactive multiple model (IMM )target tracking algorithm is proposed. The algo-rithm uses the IMM as a framework, and combines the structure of static fusion filter to solve the maneuvering target trackingin Doppler radar. |
| 2694 | 仿真结果表明了所提出算法的有效性。 | The simulation results demonstrate the effectiveness of the proposed algorithm. |
| 2695 | 建立了球栅阵列 BGA(Ball Grid Array)焊点有限元分析模型，选取焊点高度、焊点最大径向尺寸、上焊盘直径和下焊盘直径作为设计变量，以焊点应力作为目标值，采用响应曲面法设计了 29 组不同水平组合的焊点模型并建模进行仿真计算， | The finite element analysis model of BGA (Ball Grid Array)solder joints is established. The height of solder joints, the maximum radial dimension of solder joints, the diameter of upper and lower solder joints are selected as de-sign variables, and the stress of solder joints is taken as target value. 29 groups of solder joints with different levels are de-signed and simulated by response surface methodology. |
| 2696 | 建立了焊点应力与结构参数的回归方程， | The regression equation of solder joint stress and structural parame-ters is established. |
| 2697 | 基于回归方程结合遗传算法对焊点结构参数进行了优化，获得了焊点应力最小的结构参数最优水平组合。 | The structural parameters of solder joint are optimized based on the regression equation and genetic algo-rithm, and the optimal level combination of structural parameters with minimum solder joint stress is obtained. |
| 2698 | 结果表明:对于无铅焊料 SAC387，焊点应力随焊点的高度增加而减小，随最大径向尺寸的减小而减小; | The results show that for lead-free solder SAC387, the solder joint stress decreases with the increase of solder joint height, and decreases with the decrease of maximum radial dimension; |
| 2699 | 应力最小的焊点水平组合为:焊点高度 0.38mm、最大径向尺寸 0.42mm、上焊盘直径 0.34mm 和下焊盘直径 0.35mm; | the combination of solder joint level with minimum stress is:solder jointheight 0. 38mm, maximum radial dimension 0. 42mm, upper pad diameter 0. 34mm and lower pad diameter 0. 35mm. |
| 2700 | 对最优水平组合仿真验证表明优化后焊点最大应力下降了 4.66MPa，实现了BGA 焊点的结构优化。 | The re-sults show that the maximum stress of the solder joint decreases by 4. 66MPa after optimization, and the structure optimiza-tion of BGA solder joint is realized. |
| 2701 | 针对吸波超材料与柱面载体共形时其吸波性能变差的问题，提出了一种非均匀单元方案及其优化设计方法。 | The absorption performance is going to decline when the composite absorbing metamaterial is in conformi-ty with a cylindrical carrier. A non-uniform structure for conformal composite absorbing meta material and its optimization design is proposed to improve the wideband absorbing property. |
| 2702 | 在柱面共形设计中，根据吸波超材料在无曲率变化方向上的周期性建立周期边界条件。 | The periodic boundary conditions are established based onthe periodicity in the direction of no curvature change. |