ID	原文	译文
15775	本文归纳了三氧化钼纳米材料的最新研究进展,总结了不同种类三氧化钼气敏材料的制备方法。	This paper summarizes and analyzes the research progress of molybdenum oxide nano - materials, including the preparation methods of different kinds of molybdenum trioxide gas sensitive materials.
15776	简要分析了三氧化钼气体传感器目前面临的问题,展望了其发展前景。	And the problems faced by molybdenum trioxidegas sensors are discussed, the development of the gas sensor is prospected
15777	金刚石薄膜半导体材料的禁带宽度大、载流子迁移率高、击穿场强高、介电常数小、热导率高且对可见光透明,显示出优异的电学、热学、力学和光学特性,利用金刚石薄膜制作的传感探测装置具有信噪比高、响应时间快、抗辐照能力强、工作温度范围宽、器件尺寸小等优点,可替代硅探测器应用于极端环境下的探测活动。	The diamond film has wide band gap, large carrier mobility, high breakdown field strength, low dielectricconstant, high thermal conductivity, and transparency to visible light, which displays excellent electrical, thermal,mechanical and optical properties. The diamond film detectors show advantages of high signal-to-noise ratio, fast responsetime, strong anti-irradiation ability, wide operating temperature range and small device size, which can replace the silicondetectors and be applied to the detection in extreme environments.
15778	综述了金刚石薄膜传感探测器对气体（如O2、H2、CO、NH3、H2S等）、高能粒子（如质子、中子、α粒子等）、高能射线（如X射线、γ射线等）、紫外线和磁场等进行探测的应用研究现状。	This article reviews the application research progress ofdiamond film detectors for detecting gases ( such as O2 , H2 , CO, NH3 , H2 S, etc.), high - energy particles ( such asproton, neutron, α-particle, etc.), high-energy rays (such as x-ray, γ-ray, etc.), ultraviolet ray and magnetic field.
15779	最后,指出了金刚石薄膜传感探测器在产业化中存在的问题,并对其未来发展趋势与方向进行了展望。	Finally, the problems in the industrialization of the diamond film detectors are pointed out, and the future development trendand direction of the detectors are prospected.
15780	随着集成电路制造技术的发展,人们对电子器件柔性化、制备效率及环境友好的要求越来越高。	With the development of the integrated circuit manufacturing technology, the requirements of electronic device,such as flexibility, manufacturing efficiency and environmental friendliness, are getting higher.
15781	印制电路板作为器件的载体,目前仍使用模板印刷后刻蚀等方法制备,在小批量制备时效率低下,且其基板多为刚性环氧树脂,难以满足曲面及柔性电路的要求。	As the carrier of the device, the printed circuit board is still prepared by methods such as etching, which is inefficient for small batch preparation. And thesubstrate is mostly rigid epoxy resin, which is difficult to meet the requirements of curved and flexible circuits.
15782	喷墨打印作为增材制造技术中的一种,可迅速在平整或弯曲表面沉积特定材料,从而实现图案化,有着高效、非接触、无污染等特点,在电子制造领域显现出了巨大优势。	As one kind of additive manufacturing technology, inkjet printing can quickly deposit specific materials on the flat or curved surfaces forpatterning, which has the characteristics of high efficiency, non - contact, and pollution - free. So it has shown hugeadvantage in the field of electronics manufacturing.
15783	本文以喷墨打印电路板为例,对其中涉及的打印材料、提高图案精度的方法、烧结技术及打印缺陷四方面对喷墨打印制备电路板的研究进展进行介绍,并对喷墨技术在该领域的发展做出了展望。	In this article, the inkjet printed circuit boards is taken as an example,the research progress of inkjet printing to prepare circuit board is introduced, including printing materials, methods forimproving pattern accuracy, sintering technology and printing defects. Finally, the prospect of the inkjet technology isproposed.
15784	随着5G通信爆发式的发展和应用,高频元器件以及设备之间的电磁干扰和电磁辐射等电磁污染尤为严重,而吸波材料是消除电磁污染最有效的方法之一。	With the explosive development and application of 5G communication, electromagnetic pollution such aselectromagnetic interference between high frequency components and equipment and electromagnetic radiation is particularly serious. Microwave absorbing materials are the most effective method to eliminate electromagnetic pollution.