| ID | 原文 | 译文 |
| 44216 | 结果显示，在 FA/O 阻挡层抛光液中加入 1. 5 g /L 助溶剂和体积分数 0. 05% H2O2 对 SiO2和铜的去除速率选择比最优，为 1. 96。 | The results show that the best ratio of the removal rate of SiO2 and copperis 1.96 when 1.5 g /L cosolvent and 0.05% volume fraction of H2O2 added in the FA/O barrier slurry. |
| 44217 | 同时，添加了助溶剂和 H2O2 的 FA/O 阻挡层抛光液对碟形坑修正的能力为 48. 2 nm，对蚀坑修正的能力为 38. 9 nm，修正能力非常强。 | At the same time, the ability of FA/O barrier slurry by adding the cosolvent and H2O2 to correct the dishing is 48.2 nm, and the erosion is 38.9 nm, so the correction ability is very strong. |
| 44218 | 铜布线片阻挡层抛光后，碟形坑深度为 4. 7 nm，蚀坑深度为 19. 9 nm， | After the CMP ofthe barrier layer of patterned Cu wafer, the dishing depth is 4.7 nm and the erosion depth is 19.9 nm. |
| 44219 | 将碟形坑和蚀坑的深度降到较小的范围。 | The depth of the dishing and the erosion is reduced to a smaller extent. |
| 44220 | SEM 检测结果表明，铜残留较少，表面形貌较好。 | The SEM test results show that theresidual copper defects are less and the surface morphology is better. |
| 44221 | 分析了目前分段电流舵数模转换器 ( DAC) 在动态性能提升和芯片面积缩小等方面的局限性。 | Limitations of dynamic performance promoting and chips area reducing for the segmented current-steering digital-to-analog converter (DAC) were analyzed. |
| 44222 | 提出了动态元件匹配 ( DEM) 译码技术。 | A decoding technology called dynamic element matching (DEM) was proposed. |
| 44223 | 设计了 16 bit DAC 中的 DEM 译码电路结构，分析了 DEM 译码技术的原理。 | The DEM decoding circuit of 16 bit DAC were designed, and the principle of the DEM decoding technology were analyzed. |
| 44224 | 对该 16 bit DAC 的动态性能等进行了详细仿真，并完成了整体版图设计。 | The dynamic performances of the 16 bit DAC were simulated and the layout was designed. |
| 44225 | 该 DAC 核心部分芯片面积仅为 2. 2 mm2。 | The core chip area of the DAC was only 2.2 mm2. |