ID 原文 译文
43956 VCO的输出频率为 1. 68～2. 08 GHz，10 MHz 频偏处相位噪声为－147. 88 dBc /Hz。 The outputfrequency range of VCO is from 1.68 GHz to 2.08 GHz and the phase noise is －147.88 dBc /Hz @ 10 MHz.
43957 鉴相杂散和分数杂散均低于－72 dBc，分数模式下均方根抖动为 634 fs。 The reference spur and fractional spur are lower than －72 dBc and the ＲMS jitter is 634 fs.
43958 锁相环底噪声因子和闪烁噪声因子分别为－218. 4 dBc /Hz和－249. 6 dBc /Hz。 The noise floorfactor and the flicker noise factor of the puase lock loop are －218.4 dBc /Hz and －249.6 dBc /Hz, respectively.
43959 频率综合器功率为 75 mW，版图面积为 1. 2 mm×0. 8 mm。 The power of frequency synthesizer is 75 mW and occupies 1.2 mm×0.8 mm
43960 针对免滤波数字 D 类功率放大器功率级非线性和电源噪声产生的误差，提出了一种基于前馈电源噪声抑制 ( FFPSNS) 和局部闭环负反馈 ( LCLNF) 技术的免滤波数字 D 类功率放大器桥接负载 ( BTL) 功率级误差校正方法。 An error correction method was proposed, which was based on feed-forward powersupply noise suppression (FFPSNS) and local closed loop negative feedback (LCLNF) techniques forcorrecting the errors caused by the non-linear and power supply noise of the bridge-tied-load (BTL)power stage of the filterless digital class D power amplifier.
43961 该方法通过对 BTL 功率级构造一阶 LCLNF 回路，并在反馈回路中利用 FFPSNS 技术引入功率级电源噪声以在校正功率级误差的同时，进一步降低功率级电源噪声对功率放大器的输出影响。 The method corrected the errors in the powerstage by constructing the first-order LCLNF loop for the power stage and further reduced the impact of thepower supply noise on the power amplifier output by using FFPSNS technology to introduce the power supply noise into the feedback loop at the same time.
43962 仿真结果表明，当功率放大器输入为频率 1 kHz、幅度－5 dB 的正弦信号时，与一阶 LCLNF 方法相比，所提出的方法可使功率放大器输出在 800 Hz 和 1 200 Hz 处的电源互调失真 ( PS-IMD) 分量降低约 15. 6 dB ( 功率级电源噪声为频率 200 Hz，幅度－40 dB 的正弦波) ，功率放大器输出信噪比增加约为 17 dB，从而使功率放大器达到较高的性能。 The simulation results show that when the input of thepower amplifier is a sinusoidal signal with the frequency of 1 kHz and amplitude of －5 dB, with the proposed method the power supply induced inter-modulation distortion (PS-IMD) at 800 Hz and 1 200 Hz isreduced by approximately 15.6 dB (the power supply noise is a 200 Hz, －40 dB sinusoidal wave) , and theoutput signal to noise ratio of the power amplifier is increased by about 17 dB compared with the first-orderLCLNF method.Therefore, the power amplifier with the proposed method can achieve a better performance.
43963 硅通孔 ( TSV) 是三维集成电路 ( 3D-IC) 的关键技术之一，缺陷 TSV 的片上自修复对于提升 3D-IC 的可靠性具有重要意义。针对现有片上缺陷 TSV 自修复方式对冗余 TSV 数量依赖性较高、可靠性较低等问题，提出了一种包含硬修复和软修复的双重自修复方法。 Through silicon via (TSV) is one of the key technologies of the three-dimensional integrated circuit (3D-IC) .The on-chip self-repair of defective TSV has an important significance forimproving the reliability of 3D-ICs.Due to the high dependence on the number of redundant TSVs andlow reliability of existing on-chip defective TSV self-repair methods, a dual self-repair method includingboth hardware repair and software repair was proposed.
43964 该方法既可以对随机出现的缺陷 TSV 进行冗余 TSV 替换，从而实现硬修复; In this method, the random defective TSVs were replaced by redundant TSVs as the hardware repair method.
43965 也可以在冗余 TSV 数量不足时，通过两种不同的软修复策略，对信号进行 “并串－串并”转换，实现局部范围内的软修复。 And two different software repair strategieswere executed as the regional software method by doing the " parallel to serial and serial to parallel" conversion on the signal under the insufficient redundant TSVs situation.