ID 原文 译文
43796 并推导了各阶段的持续时间和影响因素， The duration and influence factors of each stage were derived.
43797 然后通过建立双脉冲测试平台，对各部分寄生电感对开关特性的具体影响进行了实验验证。 A double-pulse test platform was built to confirm individual influence of each parasiticinductance on switching characteristics by the experiment.
43798 实验结果表明，寄生电感会使开关过程中的电流、电压出现振荡，影响开关速度和可靠性， The test results show that the parasitic inductance will induce the oscillation in current and voltage during the switching process and affect the switching speed and reliability.
43799 并且各部分寄生电感对增强型 GaN HEMT 的开关过程影响程度不同， Moreover, each parasitic inductance has different effects on the switchingprocess of E-mode GaN HEMT.
43800 在实际 PCB 布局受到物理限制时，需要根据设计目标优化布局，合理分配各部分寄生电感以获得最优的开关性能。 Due to physical limits of practical PCB layout, it is necessary to optimizethe layout and distribute each parasitic inductance reasonably according to the design requirements to obtain the best switching performance.
43801 封装腔体内部的可动粒子会引起半导体器件和电路的短路或间歇性功能失效，从而对其使用可靠性产生影响。 Loose particles in the sealed cavity may occur to cause a short circuit or intermittentfunctional failure of semiconductor devices and circuits, which affect the using reliability.
43802 粒子碰撞噪声检测 (PIND) 试验可有效剔除腔体内部含有可动粒子的器件，从而被纳入多项标准中作为一项无损筛选试验并得到广泛的应用。 As one of thenon-destructive screening tests, particle impact noise detection (PIND) testing can eliminate the devicescontaining loose particles in the cavity effectively, which has been widely used.The hazard of loose particles in cavity is given.
43803 给出了腔体内部可动粒子的危害，详细研究了美国和中国军用标准 PIND 试验方法的发展历程及现状，对比了 3 种PIND 试验标准不同版本试验参数的变化， The development and present status of PIND test methods used in military standards of the United States and China are studied in detail, and changes of parameters in different versionsof three PIND test methods used in military standards are compared.
43804 分析了标准参数变化产生的影响，给出了筛选批接收的试验流程，对试验人员具有一定指导作用，提高了 PIND 筛选试验的准确性。 The influences of parameter changingare analyzed, and the flow chart of PIND for screening lot acceptance is also provided, so as to give aguidance for operators to improve the accuracy of PIND screening test.
43805 将空气隙应用于逻辑器件后段金属互连线中可以有效降低互连线间的寄生电容，提升电路信号传输速度，但制备过程仍具有一定的困难。 The application of air-gap to the back-end metal interconnect of the logic devices can effectively reduce the parasitic capacitance between interconnects and improve signal transmission speeds ofcircuits.