ID 原文 译文
42916 提出了一种快速、准确识别和定位高速焊线机微芯片图像焊点的新方法。 A new method of fast and precise recognition and location for solder pads of microchipimages of high-speed bonding machine was proposed.
42917 首先使用聚类算法对自制微芯片图像训练集中标注的边界框进行分析，得到锚框尺寸; Firstly, the clustering algorithm was used to analyzethe labeled boundary frame in the self-made microchip image training set, and the anchor frame size wasacquired.
42918 然后使用卷积神经网络对输入的微芯片图像数据集进行特征提取， Then the convolutional neural network was used to extract features of the input microchip imagedata set and the deep feature map was sampled up.
42919 对深层特征图进行上采样，与浅层特征图拼接在一起进行特征融合，用于预测焊点位置和类别; The deep feature map was then spliced with the shallow feature map for feature fusion, which was used to predict the position and type of solder pads.
42920 最后对多种尺寸图片进行训练，以缓解分辨率的突然切换对模型造成的影响，提高模型的适应能力。 Finally, images of various sizes were trained to alleviate the impact of sudden switch of the resolution on themodel and improve the adaptability of the model.
42921 采用提出的焊点识别模型在高速焊线机上对不同形状焊点的发光二极管 ( LED) 芯片进行识别， The proposed solder pad recognition model was used toidentify light emission diode (LED) chips with different solder pad shape on high-speed wire bondingmachines.
42922 实验结果表明，该模型单张图片识别速度为5 ms，定位精度为 99. 67%，比传统模板匹配算法高。 The experimental results show that the recognition speed of a single image of the model is 5 msand the positioning accuracy is 99.67%, which is higher than the conventional template matching algorithm.
42923 且该方法对微芯片形状、生产环境以及光照无一致性要求，更适合工业化生产需求。 Moreover, the method has no consistency requirements for microchip shapes, production environment and lighting, which is more suitable for industrial manufacturing needs
42924 采用超声波精细雾化施液对铌酸锂晶片进行了化学机械抛光 ( CMP) 实验，研究抛光液复配参数 ( 二氧化硅磨料含量、氧化剂含量、络合剂含量、表面活性剂含量和 pH 值) 对抛光效果的影响，以材料去除速率和表面粗糙度为评价指标， Ultrasonic fine atomized liquid polishing was applied to polish the lithium niobate wafer.The influences of the polishing slurry configuration parameters such as silica abrasive content, oxidant content, complexing agent content, surfactant content and pH value on the polishing effect were investigated.
42925 根据正交试验结果得到最优组分的抛光液， According to the orthogonal experimental results of material removal rate and surface roughness, the polishing slurry with the optimum composition was obtained.