ID 原文 译文
42436 以 MoS2 靶材和硫粉作为原料，采用磁控溅射结合硫化法制备出少层 MoS2 薄膜。 Using MoS2 target material and sulfur powder as raw materials, few-layer MoS2 thinfilms were prepared by using magnetron sputtering combined with sulfurization.
42437 采用 X 射线衍射 ( XＲD) 、原子力显微镜 ( AFM) 、扫描电子显微镜 ( SEM) 、紫外－可见分光光度计 ( UV-Vis) 、拉曼光谱和 X 射线光电子能谱 ( XPS) 等对样品的形貌、结构与光谱特性进行了表征。 The morphologies, structures and spectral characteristic of the samples were characterized by X-ray diffraction (XＲD) , atomicforce microscope (AFM) , scanning electron microscope (SEM) , ultraviolet-visible spectrophotometer(UV-Vis) , Ｒaman spectrum and X-ray photoelectron spectroscopy (XPS) .
42438 结果表明，制备的 MoS2 薄膜具有 4 层结构特征，表面均匀; The results show that theprepared MoS2 thin films have the characteristics of four-layered structure and uniform surfaces.
42439 硫化可提高 MoS2 薄膜的纯度，获得高品质薄膜，改善其性能，硫化后的 MoS2 薄膜为2H-MoS2晶体结构。 Sulfuration can improve the purity of MoS2 thin film, obtain high quality film and improve its performance.Thesulfuration MoS2 thin films have a 2H-MoS2 crystal structure.
42440 设计了一款手机三维结构并建立了手机的有限元模型， A three-dimensional structure of a mobile phone was designed and its finite elementmodel was established.
42441 通过有限元仿真研究了产品级跌落条件下底填料、螺钉间距、屏蔽框、芯片与前壳间隙等手机结构设计因子对板载芯片级封装( CSP) 组装可靠性的影响。 By finite element simulation, the effects of structural design factors of the mobilephone, including the underfill, the screw spacing, the shielding frame, and the gap between the chip andfront casing, on the reliability of the on-board chip-scale package (CSP) assembly under product-leveldrop conditions were studied.
42442 仿真结果表明:螺钉间距和屏蔽框面积可以明显影响印制电路板的弯曲程度，较小的螺钉间距以及较大的屏蔽框可以使硅芯片和焊点的最大主应力降低 20% ～30%。 Simulation results show that the screw spacing and the area of the shieldingframe can significantly affect the bending degree of the printed circuit board, as smaller screw spacingand larger shielding frame result in the reduction of maximum principal stress in the silicon chip and thesolder joints by 20%－30%.
42443 使用底填料可以改善焊点的应力分布，减缓应力集中，并降低芯片和焊点的最大主应力。 By using the underfill, stress distribution in solder joints becomes more uniform, and the maximum principal stress in both chip and solder joints is lowered than that without underfill.
42444 芯片与前壳的间隙过小可能会导致芯片与前壳发生碰撞，从而引起封装体的峰值应力迅速增加约30 MPa。 In addition, insufficient gap between the chip and front casing might lead to the collision betweenthese two parts, thereby causing the peak stress of the packaging increases significantly by about 30 MPa.
42445 研究方法和结论可以为产品在设计阶段规避板级封装失效提供思路，从而加快手机结构的设计及优化。 The research methods and conclusions are expected to provide ideas for avoiding of failures in the board-level assembly during product design phase, thus expediting the structural design and optimizationof mobile phones.