ID 原文 译文
41966 并对封装过程中的两项关键工艺，硅通孔工艺和晶圆键合与解键合工艺进行了分析; Two keyprocesses in the packaging, such as through-silicon via process and wafer bonding and de-bondingprocess are analyzed.
41967 结合实际封装工艺对晶圆级多层堆叠过程中的可靠性管理进行了论述。 Then the reliability management in wafer-level multilayer stacking is discussed inthe context of the actual packaging process.
41968 在集成电路由二维展开至三维的发展过程中，晶圆级多层堆叠技术将起到至关重要的作用。 The wafer-level multilayer stacking technology will play acrucial role in the development of integrated circuits from two-dimension to three-dimension.
41969 目前场效应晶体管生物传感器 ( BioFET) 已成功用于生物医学检测。 At present, field effect transistor biosensors (BioFETs) have been successfully used inbiomedical detection.
41970 虽然 BioFET 在生物检测方面具有快速响应、无标记和高灵敏度检测等优点，但是 BioFET 用于生理环境检测时，容易受到德拜屏蔽效应的影响，导致灵敏度降低甚至无法检测。 BioFETs have the advantages of fast response, label-free and high-sensitivity detection in biological detection, but they are susceptible to the Debye screening effect when they are usedfor physiological environment detection, resulting in decrease of sensitivity or even undetectability.
41971 阐述了 BioFET 的工作原理; Theprinciple of BioFETs is described.
41972 介绍了 BioFET 目前面临的挑战之一———德拜屏蔽效应; Debye screening effect, one of the current challenges of BioFETs, isintroduced, and the principle of Debye screening effect is explained.
41973 解释了德拜屏蔽效应的原理;探讨了克服德拜屏蔽效应的典型方法: The typical methods to overcomeDebye screening effect are discussed,
41974 增加德拜长度、优化目标物、优化器件结构以及降低电双层影响， including increasing Debye length, optimizing the target, optimizing the structure of the device, and reducing the influence of the electric double-layer.
41975 并对这 4 个方面的研究进展从增强机理、具体方法及检测效果等方面进行了详细的分析和总结。 And theresearch progress in these four aspects is analyzed and summarized in detail from the enhancement mechanism, specific methods and detection effects.