ID 原文 译文
41896 基于 GaAs 单片微波集成电路 ( MMIC) 工艺设计并制备了一款宽带射频前端多功能电路芯片，其包含功率放大器、限幅低噪声放大器 ( LNA) 和收发开关。 Based on the GaAs monolithic microwave integrated circuit (MMIC) process, a broadband ＲF front-end multifunctional circuit chip which contained a power amplifier, a limiting low noise amplifier (LNA) and transmitting and receiving switches was designed and prepared.
41897 功率放大器采用平衡式结构同时选择合适的匹配网络实现宽带匹配; The poweramplifier adopted a balanced structure and selected a suitable matching network to realize broadbandmatching.
41898 限幅器第一级采用功分结构提高耐功率能力; The first stage of the limiter adopted a power division structure to improve the power withstandcapability.
41899 LNA 前三级采用电流复用拓扑结构实现低功耗，最后一级采用自偏置结构增加动态范围; The first three stages of the LNA adopted a current multiplexing topological structure toachieve low power consumption, and the last stage used a self-biased structure to increase dynamicrange.
41900 天线端的开关具有较高的功率容量，保证信号经过开关后不会压缩而导致发射支路输出功率不足。 The switch at the antenna end had the higher power capacity, which ensured that the switchwould not cause insufficient output power due to the signal compression.
41901 测试结果显示，电路在 6～18 GHz 频带内，接收支路噪声系数典型值为 3. 7 dB，增益约为 27 dB，1 dB压缩点输出功率典型值大于 7 dBm，功耗约为 140 mW，能耐受 1 W 的连续波输入功率; The test results show that at 6－18 GHz, the receiving branch has a typical noise figure of 3.7 dB, a gain of about 27 dB, a typicaloutput power at 1 dB compression point of more than 7 dBm, a power consumption of about 140 mW, and it can withstand 1 W continuous wave input power.
41902 发射支路饱和输出功率大于30 dBm，功率附加效率典型值为 26%。 The transmitting branch has a saturation outputpower of more than 30 dBm, and a typical power added efficiency of 26%.
41903 基于三维集成技术研制了一款适用于表面贴装技术的 Ku 波段四通道 T /Ｒ 模块。 Based on 3D integration technology, a Ku-band four-channel T /Ｒ module suitable forsurface mounted technology was developed.
41904 模块内部设计成两层层叠结构，层间使用球栅阵列实现互连， The internal design of the module was a two-layer laminatedstructure, and the ball grid array was used to realize the interconnection between the layers.
41905 仿真分析模块微波垂直互连结构、腔体谐振和散热模型，实现模块的小型化。 The microwave vertical interconnection structure, cavity resonance and heat dissipation model of the module were simulated and analyzed to realize the miniaturization of the module.