ID 原文 译文
25775 在 X 射线 CT 成像检测系统中，复杂异形工件由于结构复杂，散射、硬化等现象较严重，而且在部分投影角度上，由于在射线透照方向上的有效厚度差异大，固定能量的射线剂量与厚度不匹配，投影数据质量较差，传统的CT 重建算法得到的重建图像质量低，边缘模糊，无法获取工件的完整轮廓信息。 In the X-ray CT imaging inspection system, due to the complicated structure of complex shaped workpieces, scattering, hardening and other phenomena are more serious. At some projection angles, due to the large difference in effective thickness in the ray transillumination direction, the fixed energy ray dose does not match the thickness, the quality of the projection data is poor, the reconstructed image obtained by the traditional CT reconstruction algorithm is of low quality, the edges are blurred, and the complete contour information of the workpiece cannot be obtained.
25776 为此文章研究了一种基于轮廓先验约束的复杂异形工件 CT 成像方法。 In this paper, a CT imagingmethod for complex shaped workpieces based on contour prior constraints is studied．
25777 首先利用双目立体视觉技术获取工件的轮廓信息，根据双目坐标系与 CT 坐标系间的空间位置关系完成先验图像的配准; Firstly, the binocular stereo vision technology is used to obtain the contour information of the workpiece, and the registration of the a priori image is completed according to the spatial positional relationship between the binocular coordinate system and the CT coordinate system．
25778 然后将轮廓先验纳入到 CT 重建过程中并结合 TV 正则化进行轮廓约束重建。 The contour prior is then incorporated into the CT reconstruction process and contour constrained reconstruction is performed in conjunction with TV ( Total-variation) regularization．
25779 实验结果表明，该方法能够有效地抑制伪影和噪声，保留重建图像的边缘，改善重建图像质量，有助于提高复杂异形工件缺陷检测的可靠性。 The experimental results show that the proposed method can effectively suppress artifacts and noise, preserve the edges of reconstructed images, improve the quality of reconstructed images, and improve the reliability of defect detection of complex shaped workpieces．
25780 建立了微尺度芯片尺寸封装焊点有限元分析模型并对其进行扭转应力应变仿真分析与实验验证。 The finite element analysis model of micro-scale chip scale package( CSP) solder joints is set up and stress and strain analysis are performed under torsion load, and the verification experiment is also carried out．
25781 分析了焊点材料、焊点直径、焊盘直径和焊点高度对焊点扭转应力应变的影响; The influence of solder joint diameter, solder joint diameter, pad diameter and solder joint height on the torsion stress and strain of micro-scale CSP solder joints are analyzed．
25782 以焊点材料、焊点直径、焊盘直径和焊点高度为设计变量，采用响应面法设计了 29 组不同水平组合的焊点模型并获取了相应焊点扭转应力，建立了焊点扭转应力与焊点结构参数的回归方程，结合遗传算法对焊点结构参数进行了优化。 The solder joint material, solder joint diameter, pad diameter and solder joint height are selected as design variables; 29 groups of solder joints with different levels are designed and simulated by response surfaceme thodology. The regression equation of solder joint torsion stress and structural parameters is established. The structural parameters of solder joint are optimized based on the regression equation and genetic algorithm．
25783 结果表明: 焊点材料为 SAC305 时扭转应力应变最大，焊点最大扭转应力应变随焊点直径和焊盘直径增加而减小、随焊点高度增大而增大; The results show that the maximum torsion stress and strain occurs with the solder joints material of SAC305, the maximum solder joint torsion stress and strain decreases with the increase of solder joint diameter and pad diameter, and increases with the increase of solder jointheight;
25784 最优焊点结构参数水平组合为: 焊点材料 SAC305、焊点直径 0. 22mm、焊盘直径 0. 14mm 和焊点高度 0. 14mm;仿真验证表明最优焊点最大扭转应力下降了 3. 7MPa。 the optimal combination of solder joint level is the solder joint material of SAC305, the solder joint diameter of 0. 22mm, the pad diameter of 0. 14 mm and the solder joint height of 0. 14mm, and simulation verification result shows the maximum stress of the solder joint decreases by 3. 7MPa after optimization．