| ID | 原文 | 译文 |
| 673 | 首先建立分布式星群功率分配模型，将复杂的分式问题转化为易于求解的减法形式问题。 | First we built distributed satellite cluster power allocation model and transformed the problem of fractional form to simple subtractive form. |
| 674 | 然后基于凸优化理论，提出功耗-数据速率权衡功率分配算法，并讨论了能量效率(energy efficiency)与频谱效率(spectral efficiency)之间的权衡关系。 | Then based on convex optimization, the power-data rate trade off pow-er allocation algorithm is proposed, and the trade-off between energy efficiency (EE)and spectral efficiency (SE)is dis-cussed. |
| 675 | 仿真结果验证了提出算法的有效性和 EE-SE 权衡关系，并分析了电路功耗对系统性能的影响。 | The numerical results validate the effectiveness of the proposed algorithm and the EE-SE tradeoff, and the influenceof circuit power on system performance is also analyzed. |
| 676 | 建立了板级组件 BGA(Ball Grid Array)焊点有限元分析模型，对 BGA 焊点进行了再流焊冷却过程应力仿真分析， | A finite element model of board level assembly BGA (Ball Grid Array)solder joint is established, the stress simulation analysis of BGA solder joint in the cooling process of reflow soldering is carried out, |
| 677 | 设计并完成了验证性实验以验证仿真分析方法的有效性，分析了焊点结构参数和材料变化对焊点再流焊冷却过程应力应变的影响， | the confirmatory ex-periment is designed and carried out to verify the validity of simulation analysis method, and the influence of solder jointstructure parameters and material on the stress and strain of solder joint are analyzed. |
| 678 | 采用响应面法建立了焊点应力与结构参数的回归方程，结合遗传算法对焊点结构参数进行了优化。 | The regression equations of the stressand structure parameters of the solder joints is established by the response surface method, and solder joint structure parame-ters are optimized by genetic algorithm. |
| 679 | 结果表明：实验结果证明了仿真分析的有效性; | The results show that the experiment results verify the effectiveness of the simulationanalysis, |
| 680 | 焊点应力随着焊点高度的增加而增大，随着焊点直径的增加而减小; | the stress of the solder joint increases with the increase of the height of the solder joint, and decreases with the in-crease of the diameter of the solder joint, |
| 681 | 最优焊点结构参数水平组合为:焊点高度 0.44mm、焊点直径 0.65mm、焊盘直径 0.52mm 和焊点间距 1.10mm; | and the optimal level combination of solder joint structure parameters is the heightof 0. 44mm, the diameter of 0. 65mm, the pad diameter of 0. 52mm and the solder joint pitch of 1. 10mm, |
| 682 | 对该最优焊点仿真验证表明最大应力下降了 0.1101MPa。 | the simulation re-sults of the optimal level combination of solder joint show that the maximum stress decreases by 0. 1101MPa. |