ID 原文 译文
15655 结果表明,由于Pb元素的共价半径大和表面能低,导致Pb具有很强的偏析能力,而Cu的偏析能力相对较弱。 The results showed that Pb element had strong segregation ability owing to its large covalent radius and low surface energy, while the segregation of Cu is relatively weak.
15656 Pb和Cu主要富集在铝箔表面50～60 nm附近,富集位置取决于杂质原子半径,而与偏析能无关。 Pb and Cu were mainly concentrated at the depth of 50-60 nm near the aluminum foil surface, and the concentrated position was dependent on the atomic radius instead of the segregatior energy of the impurity atoms.
15657 另外,由于邻位Pb原子更容易使表面结构驰豫,铝箔内部Pb倾向于维持粒子形态,而Cu没有表现出很明显的聚集倾向,在原子形态和粒子形态之间保持一种平衡。 In addition, Pb tended to maintain the particle form in the aluminum foil due to the preferential relaxation of surface structure for ortho Pb atoms. In contrast, Cu did not show significant aggregation, instead, a balance between the atomic form and the particle form of Cu was kept.
15658 因此高压光箔中Pb和Cu表现出不同的固溶状态。 Therefore, Pb and Cu exhibited different solid solution states in high-voltage aluminum foil.
15659 为了得到小尺寸、高焊接可靠性的多层瓷介电容器,分别采用蘸浆端涂工艺和薄膜溅射工艺进行端电极制备,研究了两种端面金属化工艺的优缺点及其制备端电极的焊接可靠性。 In order to obtain multilayer ceramic dielectric capacitors with small size and high welding reliability, the terminal electrodes were prepared by dipping paste end coating and thin film sputtering process, respectively. The advantages and disadvantages of the two metallization processes and the welding reliability of the prepared terminal electrodes were studied.
15660 结果表明:与传统端涂工艺相比,蘸浆端涂工艺不仅彻底地摆脱了对于高精度封端设备和工装夹具的依赖,生产成本较低,而且更适用于小尺寸产品端电极的制备; The results show that compared with the traditional end coating process, the dipping paste end coating process not only gets rid of the dependence on the high-precision end coating equipment and fixture, but also has a lower production cost, which is more suitable for the preparation of terminal electrode of small-size product.
15661 同时,薄膜溅射工艺制备的端电极层具有更高的致密性,这不仅解决了端涂工艺制备端电极推球实验不合格问题,显著提高了引出端电极的焊接可靠性。 Meanwhile, the terminal electrodes prepared by thin film sputtering process has a higher density. This process improves the qualification of the terminal electrode wire bond shear test, and the terminal electrode welding reliability can be improved.
15662 而且为引出端电极层结构设计提供了多样化的解决方案,满足了用户的不同使用需求,拓宽了应用场景。 Furthermore, it provides multiple solutions for the structure design of the terminal electrode laver, which meets different requirements of the users.
15663 研究了多层瓷介电容器（MLCC）端电极制备环节中产品翻边宽度、端电极底银层厚度、烧端峰值温度、峰值温度保温时间及烧端装载密度对产品端电极附着力的影响。 The effects of dipping process and Ag-sintering process of MLCC end electrode preparation were investigated. The results show that MLCC bending strength and shearing strength properties both increase as Ag-turnup width and Ag-thickness increases.In general.
15664 结果显示,随着翻边宽度和底银层厚度的增加,产品相应的端面结合强度随之提升,当翻边宽度为0.5 mm、底银层厚度为26μm左右时,产品的抗弯曲性能>8 mm,平均极限抗剪切力为165.17 N; MLCC prepared with 0.5 mm Ag-turnup width and 26 um Ag-thickness exhibits greater than 8 mm bending height and 165. 17 N average shearing force.