| ID | 原文 | 译文 |
| 15395 | 介绍了射频识别(RFID)技术的起源与发展历程,根据RFID技术的原理,指出RFID系统相对于传统识别技术的优势并阐明了标签天线在RFID系统中的关键作用。 | This article reviews the history and development of radio frequency identification(RFID) technology. By explaining the principle of RFID technology, the advantages of RFID system are revealed over traditional identification technology, and the significance of tag antenna in RFID system is expounded. |
| 15396 | 简述了目前RFID技术在市场上的典型应用,分析了天线设计的技术难点,并对国内外关于实现标签天线小型化、宽频带、高增益与阻抗匹配的设计方法和研究进展进行了总结。 | After that, the typical commercial applications of RFID technology are briefly described; The technical difficulties of antenna design are analyzed; And the design methods and research process at home and abroad are then surveyed on the miniaturization, broad bandwidth, high gain and impedance matching of tag antenna. |
| 15397 | 基于RFID天线的工作原理,说明了标签天线设计的基本原则,概述了标签天线设计的基本流程及性能测试方法。 | The article then discusses the design criteria, design process and performance test method of tag antenna based on the working principle of RFID antenna. |
| 15398 | 分析表明,在保证天线小型化的前提下,解决天线尺寸与性能间协调设计的技术难点,RFID系统将在物联网等领域拥有巨大的市场前景。 | The analysis indicate that, under the premise of ensuring the antenna miniaturization and balancing the antenna size and performance, the RFID system will have a great market prospect in the Internet of Things and other fields. |
| 15399 | 随着电力电子器件向着更高功率密度、更小体积和更高集成度等方向发展,特别是第三代半导体SiC和GaN功率芯片的应用,研究满足高功率密度、高工作电压、耐高温的功率器件封装用互连材料成为近年来的重要课题,开发低温连接、高温服役的高可靠性无铅互连材料具有重要意义。 | With the development of power devices and the application of third-generation semiconductor materials(SiC and GaN), the electronics device tends to be high power density, high operating voltage and high operating temperature. As a result, novel die attachment materials become a topic of focus, which has low bonding or sintering temperature and high service-temperature. |
| 15400 | 低温烧结铜基浆料具有价格低廉、导电导热性能好、抗电迁移等优点,是新型功率器件封装互连中理想的连接材料之一。 | Novel copper-based paste is one of the ideal die attachment materials due to its low price, excellent thermal, electrical and mechanical performance. |
| 15401 | 通过结合纳米银和纳米铜浆料的优点能够获得连接稳定、烧结和服役性能可靠的铜基接头。 | It includes Cu-Ag hybrid nanoparticles paste, Cu-Ag nanoalloy paste, and Cu@Ag composite paste. |
| 15402 | 概述了包括纳米铜银混合浆料、纳米铜银合金浆料以及银包铜复合浆料等铜基浆料的常见制备技术,阐释了各种浆料的烧结机理和接头性能,并对高性能铜基浆料的应用前景进行了展望。 | The high-stable and reliable copper-based joint should be achieved for the application of power electronics devices. This review summarizes the current progress of the copper-based pastes, discusses its sintering mechanism, analyzes the performance of the copper-based joints, and gives prospect for copper-based pastes research in the future. |
| 15403 | 随着数字通信在大数据以及物联网等领域的应用,推动了下一代存储设备的发展。 | The exploration of next－generation data storage devices has been stimulated with the rapid development of digitalcommunications in the big data and internet of things． |
| 15404 | 阻变式存储器因其功耗低、尺寸可调、操作速度快等优点被认为是最有前景的信息存储器件之一。 | Resistive random access memories( RRAM) are considered as one ofthe most promising information storage devices due to its low power consumption，downscaling potential，and fast operation. |