ID 原文 译文
12674 提出4种抑制热应力的实验方案，并得出优化退火条件是解决热应力问题最有效的办法。 Four experimental schemes for suppressing thermal stress were proposed， and it is concluded that the optimization of annealing conditions is the most effective way to solve the thermal stress problem.
12675 采用智能剥离技术在优化退火条件下成功制备了 4英寸(1英寸= 2.54 cm)晶圆级GeOI衬底，转移的错薄膜厚度偏差小于 2%,均方根表面粗糙度低至0.42 nm， 喇曼光谱显示转移的错薄膜内残余应カ较小，制备的 GeOI衬底可以为后续高迁移率器件制备或硅基(-V族异质集成提供材料平台。 The 4-inch ( # inch = 2. 54 cm) wafer-scale GeOI substrate was successfully prepared by using smart-cut technique at optimized annealing conditions. The thickness deviation of the transferred germanium film is less than 2%，the root-mean-square surface roughness can be reduced to 0. 42 nm，and the Raman spectrum shows that the residual stress in the transferred germanium film is small. The prepared GeOI substrate can provide a material platform for subsequent high-mobility device fabrication or Si based (-Vheterogeneous integration.
12676 90 nm节点及以下的芯片在回流组装中，材料热失配引起的凸点剪切易导致低介电常数，布线介质层中发生断裂失效，即芯片封装交互影响问题。 In the reflow assembly of chips with 90 nm node and below， the low dielectric constant (k) layer in back end of line (BEOL) is prone to crack and failure due to bump shear caused by material thermal mismatch，that is the chip packaging interaction problem.
12677 通过单个凸点的剪切试验，结合凸点下方的布线层失效分析，评估芯片布线层可靠性。 A shear test for a single bump and a followed failure analysis of the wiring layer under bumps were performed to evaluate the reliability of the chip wiring layer.
12678 并采用有限元分析方法对一款40nm节点芯片的凸点进行剪切模拟，用子模型分析了凸点受剪切时，布线层中微裂纹的裂尖能量释放率(ERR)随剪切高度、剪切力和微裂纹长度的变化。 The bump shear of a chip with 40 nm node was simulated by finite element analysis method. And a sub—model was applied to analyze the changes of the energy release rate (ERR) at crack tips of the microcracks in the wiring layer with shear height，shear force and microcrack length when the bumps were sheared.
12679 研究结果表明：模拟与试验结果相符，裂尖 ERR随剪切高度、剪切カ、微裂纹长度的增加而升高，降低凸点剪切高度有利于减小低k材料断裂的可能性。 The research results show that the simulation results are consistent with the experimental results. The ERR at crack tips increases with the increase of shear height，shear force and microcrack length. Decreasing the shear height of bumps is helpful to reduce the possibility of low-k materials fracture.
12680 为了更精确地掌握南海海域大气波导的统计特征,详细分析了大气折射率关于温度、湿度和压强的敏感性，并在此基础上利用$006#$010年南海航次GPS探空资料对该海域表面波导和悬空波导的发生概率和波导特征参数进行了统计分析。 In order to master the statistical characteristics of atmospherc duct in the South China Sea more accurately, the sensitivity of atmospherc refractive index of temperature, pressure and humidity are analyzed in detail. Based on the cruis ing GPS sounding data in the South China Sea from the year of $006 to $010, statistical analysis of the occurrence probabllity of surface-based duct and elevated duct, and their characteristic parameters are computed and analyzed.
12681 结果表明：表面波导年平均发生概率基本在$0%以下，波导顶平均高度约为167 m，陷获层厚度一般不超过30 m，强度介于4.5〜9. 6 M,年度平均值为7.5 M。 The results show that the average occurrence proba- bllity of surface-based duct is relatvely low, generally less than $0%. The average height of the top of surface-based duct is about 167 m, and the thckness of the trapped layer is below 30 m. The strength is between 4. 5 M—units and 9. 6 M—units, and the annual average is 7. 5 M—units.
12682 悬空波导年平均发生概率接近50%，波导顶高度一般介于1 100〜1 300 m，陷获层厚度比表面波导略高，平均厚度为3$. 8 m，强度平均值与表面波导相当，但跨度比表面波导要小得多。 Whlle the average occurrence probablty of elevated duct s near to 50% , and the heght of the top of elevated ducts generally between 1 100 mand 1 300 m. The thckness of the trapped layers at an average value of 3$.8 m, which slightly hgher than that of the surface-based duct. The average strength of elevated duct s close to that of the surface-based duct , but ts span s much smaller.
12683 统计分析结果可为南海区域舰载无线电系统的运行保障提供参考・ These results can provde reference for the operaton of shp-borne rado system n the South Chna Sea.